Topic Date Beijing, CN Berlin, DE Chicago (IL), USA
CANopen FD status and future 2024-12-12 2024-12-12 22:00 2024-12-12 15:00 2024-12-12 08:00
CiA bootloader for CAN-based devices 2025-01-30 2025-01-30 22:00 2025-01-30 15:00 2025-01-30 08:00
CAN FD status and future 2025-03-20 2025-03-20 22:00 2025-03-20 15:00 2025-03-20 09:00
Functional safety and CANopen 2025-06-05 2025-06-05 21:00 2025-06-05 15:00 2025-06-05 08:00
CANopen Lift status and future 2025-10-01 2025-10-01 21:00 2025-10-01 15:00 2025-10-01 08:00
Cybersecurity and CAN FD 2025-11-20 2025-11-20 22:00 2025-11-20 15:00 2025-11-20 08:00
CAN XL status and future 2025-12-11 2025-12-11 22:00 2025-12-11 15:00 2025-12-11 08:00

IG06 SIG01 Functional safety

09:00 to 11:00

  • Invitation

Business Committee

09:00 to 12:00

  • Invitation

IG04 SIG01 TF02 CAN XL higher-layer protocols

13:00 to 15:00

  • Invitation

IG04 SIG01 TF01 CAN XL physical layer topic eye diagram

13:00 to 15:00

  • Invitation

MG03 CAN XL

13:00 to 15:00

  • Invitation

IG03 Profiles

13:00 to 15:00

  • Invitation
  • Embedded World, booth 1/203, Nuremberg, Germany, March 11 to 13, 2025
  • Bauma, booth A2/337, Munich, Germany, April 07 to 13, 2025
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